Tai Chong Chai
About
Tai Chong Chai has authored 31 papers that have received a total of 203 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). Tai Chong Chai is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers) and collaborates with scholars based in Singapore, Taiwan and United States. Tai Chong Chai's co-authors include Xiaowu Zhang, A. D. Trigg, Fa Xing, Seung Wook Yoon and V. Kripesh and has published in prestigious journals such as Materials Science and Engineering A, Microelectronics Reliability and IEEE Transactions on Device and Materials Reliability
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Carlos Valencia are published in Top fields papers by Xinyuan Wang are about Top fields papers by Hassani Messaoud are about Top fields papers by Katarzyna Kopczewska are about Top fields papers by Paul Haun are about Top countries impacted by papers by Pradeep Raj Top journals papers by Beniamino Mecozzi are published in Top journals papers by Eberhard Ulich are published in