T.B. Lim
About
T.B. Lim has authored 24 papers that have received a total of 441 indexed citations.
This includes 13 papers in Mechanics of Materials, 10 papers in Surfaces, Coatings and Films and 9 papers in Mechanical Engineering. The topics of these papers are Surface Modification and Superhydrophobicity (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (4 papers). T.B. Lim is often cited by papers focused on Surface Modification and Superhydrophobicity (10 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (4 papers) and collaborates with scholars based in Singapore, China and Australia. T.B. Lim's co-authors include K. G. Neoh, E. T. Kang, C.Q. Cui, K. L. Tan and A.A.O. Tay and has published in prestigious journals such as Chemosphere, Polymer and Materials Research Bulletin
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