T.C. Chai

15 papers and 297 indexed citations i.

T.C. Chai has authored 15 papers that have received a total of 297 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (12 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). T.C. Chai is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (12 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers) and collaborates with scholars based in Singapore, China and Taiwan. T.C. Chai's co-authors include Xiaowu Zhang, Fa Xing, V. Kripesh, Vasarla Nagendra Sekhar and John H. Lau and has published in prestigious journals such as Materials Horizons, Journal of Electronic Materials and Microelectronics Reliability