Tetsuro Nishimura

19 papers and 398 indexed citations i.

Tetsuro Nishimura has authored 19 papers that have received a total of 398 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 5 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers). Tetsuro Nishimura is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in Australia, Japan and Malaysia. Tetsuro Nishimura's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Keith Sweatman, Qinfen Gu and Syo Matsumura and has published in prestigious journals such as Journal of Power Sources, Scripta Materialia and Japanese Journal of Applied Physics.