Tik Sun
About
Tik Sun has authored 16 papers that have received a total of 476 indexed citations.
This includes 10 papers in Electronic, Optical and Magnetic Materials, 8 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (9 papers), Semiconductor materials and devices (7 papers) and Metal and Thin Film Mechanics (6 papers). Tik Sun is often cited by papers focused on Copper Interconnects and Reliability (9 papers), Semiconductor materials and devices (7 papers) and Metal and Thin Film Mechanics (6 papers) and collaborates with scholars based in United States, France and South Korea. Tik Sun's co-authors include Katayun Barmak, Kevin R. Coffey, Bo Yao, Andrew P. Warren and Amith Darbal and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B
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