Tomohiro Uno

19 papers and 249 indexed citations i.

Tomohiro Uno has authored 19 papers that have received a total of 249 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (4 papers). Tomohiro Uno is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in Japan. Tomohiro Uno's co-authors include Kohei Tatsumi, Atsushi Ogura, Mitsuhiro Hanabe, Masato Ishikawa and Hideaki Machida and has published in prestigious journals such as Applied Physics Letters, Japanese Journal of Applied Physics and MATERIALS TRANSACTIONS