Tong An
About
Tong An has authored 60 papers that have received a total of 579 indexed citations.
This includes 41 papers in Electrical and Electronic Engineering, 31 papers in Mechanical Engineering and 16 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloys Composites Properties (11 papers). Tong An is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloys Composites Properties (11 papers) and collaborates with scholars based in China, United Kingdom and Hong Kong. Tong An's co-authors include Fei Qin, Pei Chen, Yanwei Dai, Yanpeng Gong and Si Chen and has published in prestigious journals such as Materials Science and Engineering A, IEEE Transactions on Power Electronics and Journal of Environmental Management
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by WHF Sasse Top authors papers by Xin Zhu are co-authored with Top journals papers by Seulgi Lee are published in Top fields papers by Rong Liu are about Top fields papers by T. Shinozuka are about Top fields papers by Cheng‐Yao Lo are about Top countries impacted by papers by Guowu Li Top authors papers by Camille Ganter are co-authored with