Toni T. Mattila

32 papers and 654 indexed citations i.

Toni T. Mattila has authored 32 papers that have received a total of 654 indexed citations. This includes 29 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (13 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Toni T. Mattila is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (13 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers) and collaborates with scholars based in Finland, United States and China. Toni T. Mattila's co-authors include J.K. Kivilahti, Mervi Paulasto‐Kröckel, Tomi Laurila, Juha Karppinen and Hongbo Xü and has published in prestigious journals such as Nature, Journal of materials research/Pratt's guide to venture capital sources and Computational Materials Science