Toshihisa Nonaka

11 papers and 289 indexed citations i.

Toshihisa Nonaka has authored 11 papers that have received a total of 289 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Copper Interconnects and Reliability (2 papers). Toshihisa Nonaka is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Copper Interconnects and Reliability (2 papers) and collaborates with scholars based in Japan and United States. Toshihisa Nonaka's co-authors include Jun Mizuno, Shuichi Shoji, Akitsu Shigetou, Hiroshi Takahashi and Tetsuya Hasegawa and has published in prestigious journals such as Thin Solid Films, Japanese Journal of Applied Physics and Journal of Electronic Materials