Tung‐Han Chuang

196 papers and 2.7k indexed citations i.

Tung‐Han Chuang has authored 196 papers that have received a total of 2.7k indexed citations. This includes 121 papers in Electrical and Electronic Engineering, 118 papers in Mechanical Engineering and 63 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (103 papers), 3D IC and TSV technologies (46 papers) and Aluminum Alloys Composites Properties (43 papers). Tung‐Han Chuang is often cited by papers focused on Electronic Packaging and Soldering Technologies (103 papers), 3D IC and TSV technologies (46 papers) and Aluminum Alloys Composites Properties (43 papers) and collaborates with scholars based in Taiwan, United States and Germany. Tung‐Han Chuang's co-authors include L.C. Tsao, Shih‐Ying Chang, Sheng‐Chi Chen, Hui Sun and M. S. Yeh and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Scientific Reports