T.Y. Lin

18 papers and 244 indexed citations i.

T.Y. Lin has authored 18 papers that have received a total of 244 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Mechanical Behavior of Composites (3 papers). T.Y. Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Mechanical Behavior of Composites (3 papers) and collaborates with scholars based in Taiwan, United States and Singapore. T.Y. Lin's co-authors include Rong-Jian Chen, Chauchin Su, Jui‐Lin Lai, Michael Pecht and Diganta Das and has published in prestigious journals such as Journal of Power Sources, Sensors and IEEE Transactions on Electron Devices