Ulrich Tetzlaff
About
Ulrich Tetzlaff has authored 33 papers that have received a total of 359 indexed citations.
This includes 27 papers in Mechanical Engineering, 8 papers in Mechanics of Materials and 7 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and High Entropy Alloys Studies (6 papers). Ulrich Tetzlaff is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (7 papers) and High Entropy Alloys Studies (6 papers) and collaborates with scholars based in Germany, Brazil and United Kingdom. Ulrich Tetzlaff's co-authors include Márcio C. Fredel, Andreas Schießl, Florian Pyczak, H. Mughrabi and Horst Biermann and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Scripta Materialia
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