V. Kripesh
About
V. Kripesh has authored 43 papers that have received a total of 678 indexed citations.
This includes 38 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 10 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Copper Interconnects and Reliability (7 papers). V. Kripesh is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Singapore, United States and Taiwan. V. Kripesh's co-authors include John H. Lau, Xiaowu Zhang, A.A.O. Tay, D. Pinjala and Navas Khan and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Alloys and Compounds
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by James E. Evans are co-authored with Top journals papers by Lei Hou are published in Top authors papers by Ying Quan are co-authored with Top countries impacted by papers by Ronald Bewley Top authors papers by Amin J. Barakat are co-authored with Top journals papers by Ziyong Sun are published in Top authors papers by Michael Pidcock are co-authored with Top fields papers by G. Walters are about