V. Kripesh

43 papers and 678 indexed citations i.

V. Kripesh has authored 43 papers that have received a total of 678 indexed citations. This includes 38 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 10 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Copper Interconnects and Reliability (7 papers). V. Kripesh is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Singapore, United States and Taiwan. V. Kripesh's co-authors include John H. Lau, Xiaowu Zhang, A.A.O. Tay, D. Pinjala and Navas Khan and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Alloys and Compounds