V. Sarihan
About
V. Sarihan has authored 17 papers that have received a total of 265 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). V. Sarihan is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers) and collaborates with scholars based in United States. V. Sarihan's co-authors include L.L. Mercado, Yifan Guo, Dawei Zheng, M. Mahalingam and Yue Guo and has published in prestigious journals such as Materials Science and Engineering A, International Journal of Solids and Structures and Journal of Mechanical Design
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