Vasarla Nagendra Sekhar

29 papers and 154 indexed citations i.

Vasarla Nagendra Sekhar has authored 29 papers that have received a total of 154 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (25 papers) and Copper Interconnects and Reliability (4 papers). Vasarla Nagendra Sekhar is often cited by papers focused on 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (25 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in Singapore, Japan and Taiwan. Vasarla Nagendra Sekhar's co-authors include John H. Lau, Xiaowu Zhang, V. Kripesh, Chong Ser Choong and Fa Xing and has published in prestigious journals such as Materials Letters, Microelectronics Reliability and Journal of Materials Science Materials in Electronics.