Vemal Raja Manikam
About
Vemal Raja Manikam has authored 9 papers that have received a total of 367 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (5 papers) and 3D IC and TSV technologies (4 papers). Vemal Raja Manikam is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (5 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in Malaysia and United States. Vemal Raja Manikam's co-authors include Kuan Yew Cheong and Khairunisak Abdul Razak and has published in prestigious journals such as Materials Science and Engineering B, Microelectronics Reliability and Journal of Materials Science Materials in Electronics.
In The Last Decade
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