Verena Hein

12 papers and 433 indexed citations i.

Verena Hein has authored 12 papers that have received a total of 433 indexed citations. This includes 7 papers in Electronic, Optical and Magnetic Materials, 6 papers in Electrical and Electronic Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (7 papers), Metal and Thin Film Mechanics (4 papers) and Electronic Packaging and Soldering Technologies (4 papers). Verena Hein is often cited by papers focused on Copper Interconnects and Reliability (7 papers), Metal and Thin Film Mechanics (4 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in Germany and United States. Verena Hein's co-authors include Kirsten Weide-Zaage, M. Ackermann, F. Erdoğan and M. Pohl and has published in prestigious journals such as Bell System Technical Journal and Microelectronics Reliability