Vincent Fiori
About
Vincent Fiori has authored 23 papers that have received a total of 110 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 3 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers). Vincent Fiori is often cited by papers focused on 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers) and collaborates with scholars based in France, Switzerland and Czechia. Vincent Fiori's co-authors include C. Tavernier, A. Farcy, P. Coudrain, Ο. Thomas and Marie‐Ingrid Richard and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Electron Devices and Microelectronic Engineering
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