Vladimir Cherman

46 papers and 373 indexed citations i.

Vladimir Cherman has authored 46 papers that have received a total of 373 indexed citations. This includes 32 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 12 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (18 papers) and Heat Transfer and Optimization (13 papers). Vladimir Cherman is often cited by papers focused on 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (18 papers) and Heat Transfer and Optimization (13 papers) and collaborates with scholars based in Belgium, United States and Egypt. Vladimir Cherman's co-authors include Eric Beyne, Ingrid De Wolf, Herman Oprins, Tiwei Wei and Martine Baelmans and has published in prestigious journals such as International Journal of Heat and Mass Transfer, IEEE Transactions on Power Electronics and Japanese Journal of Applied Physics.