Vladimı́r Székely

52 papers and 1.0k indexed citations i.

Vladimı́r Székely has authored 52 papers that have received a total of 1.0k indexed citations. This includes 32 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 7 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (7 papers) and Advancements in Semiconductor Devices and Circuit Design (7 papers). Vladimı́r Székely is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (7 papers) and Advancements in Semiconductor Devices and Circuit Design (7 papers) and collaborates with scholars based in Hungary, France and Slovakia. Vladimı́r Székely's co-authors include M. Rencz, A. Poppe, M. Rencz, B. Courtois and J.M. Karam and has published in prestigious journals such as Electronics Letters, Optics Communications and Solid-State Electronics