W. T. Chen
About
W. T. Chen has authored 15 papers that have received a total of 453 indexed citations.
This includes 13 papers in Mechanics of Materials, 5 papers in Electrical and Electronic Engineering and 3 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Numerical methods in engineering (4 papers). W. T. Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Numerical methods in engineering (4 papers) and collaborates with scholars based in United States. W. T. Chen's co-authors include Yifan Guo, Lorraine M. Siperko, R. Rosenberg, E. Sacher and Mark D. Poliks and has published in prestigious journals such as Journal of Applied Mechanics and IBM Journal of Research and Development
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