Wayne Huang
About
Wayne Huang has authored 16 papers that have received a total of 436 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 10 papers in Materials Chemistry and 6 papers in Biomedical Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers), Electrocatalysts for Energy Conversion (5 papers) and Corrosion Behavior and Inhibition (4 papers). Wayne Huang is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers), Electrocatalysts for Energy Conversion (5 papers) and Corrosion Behavior and Inhibition (4 papers) and collaborates with scholars based in United States. Wayne Huang's co-authors include John W. Weidner, Srini Raghavan, Ralph E. White, S. Raghavan and Robert J. Small and has published in prestigious journals such as Journal of the American Chemical Society, Journal of The Electrochemical Society and Electrochemical and Solid-State Letters.
In The Last Decade
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