Wei‐Tsu Tseng

50 papers and 765 indexed citations i.

Wei‐Tsu Tseng has authored 50 papers that have received a total of 765 indexed citations. This includes 36 papers in Electrical and Electronic Engineering, 36 papers in Biomedical Engineering and 17 papers in Mechanical Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (36 papers), Semiconductor materials and devices (19 papers) and Copper Interconnects and Reliability (16 papers). Wei‐Tsu Tseng is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (36 papers), Semiconductor materials and devices (19 papers) and Copper Interconnects and Reliability (16 papers) and collaborates with scholars based in Taiwan, United States and Switzerland. Wei‐Tsu Tseng's co-authors include D. Canaperi, E. Liniger, Laertis Economikos, John H. Zhang and A. Simon and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society