Wenhui Zhu
About
Wenhui Zhu has authored 115 papers that have received a total of 1.5k indexed citations.
This includes 69 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 26 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (32 papers) and Electrodeposition and Electroless Coatings (16 papers). Wenhui Zhu is often cited by papers focused on Electronic Packaging and Soldering Technologies (40 papers), 3D IC and TSV technologies (32 papers) and Electrodeposition and Electroless Coatings (16 papers) and collaborates with scholars based in China, Singapore and Japan. Wenhui Zhu's co-authors include Junhui Li, Liancheng Wang, Fuliang Wang, Can Zhou and Hu He and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Journal of The Electrochemical Society
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