William L. Benard

7 papers and 333 indexed citations i.

William L. Benard has authored 7 papers that have received a total of 333 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Materials Chemistry. The topics of these papers are Shape Memory Alloy Transformations (3 papers), 3D IC and TSV technologies (2 papers) and Advanced MEMS and NEMS Technologies (2 papers). William L. Benard is often cited by papers focused on Shape Memory Alloy Transformations (3 papers), 3D IC and TSV technologies (2 papers) and Advanced MEMS and NEMS Technologies (2 papers) and collaborates with scholars based in United States. William L. Benard's co-authors include H. Kahn, Michael Huff, A. H. Heuer, Tony Ivanov and Christopher Meyer and has published in prestigious journals such as Journal of Microelectromechanical Systems and ECS Transactions