Wu-Hu Li
About
Wu-Hu Li has authored 13 papers that have received a total of 292 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), Copper Interconnects and Reliability (3 papers) and Gold and Silver Nanoparticles Synthesis and Applications (3 papers). Wu-Hu Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), Copper Interconnects and Reliability (3 papers) and Gold and Silver Nanoparticles Synthesis and Applications (3 papers) and collaborates with scholars based in Hong Kong, United Kingdom and Germany. Wu-Hu Li's co-authors include Nai‐Teng Yu, Xiaoyuan Li, Richard J. Nichols, Qiling Zhong and Zhong‐Qun Tian and has published in prestigious journals such as Langmuir, Chemical Physics Letters and Physical Chemistry Chemical Physics
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