W.W.-M. Dai
About
W.W.-M. Dai has authored 26 papers that have received a total of 196 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 5 papers in Hardware and Architecture and 4 papers in Materials Chemistry. The topics of these papers are VLSI and FPGA Design Techniques (9 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (7 papers). W.W.-M. Dai is often cited by papers focused on VLSI and FPGA Design Techniques (9 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (7 papers) and collaborates with scholars based in United States, China and Japan. W.W.-M. Dai's co-authors include Peng Ding, Xinhua Pan, Bin Lu, Jingyun Huang and Zhihong Ye and has published in prestigious journals such as Applied Physics Letters, Physics Letters A and Thin Solid Films
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