X. F. Ang

11 papers and 194 indexed citations i.

X. F. Ang has authored 11 papers that have received a total of 194 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Molecular Junctions and Nanostructures (5 papers). X. F. Ang is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Molecular Junctions and Nanostructures (5 papers) and collaborates with scholars based in Singapore and United States. X. F. Ang's co-authors include Jun Wei, Zhong Chen, C.C. Wong, Jun Wei and Chuan Seng Tan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films