Xiang Dai

22 papers and 354 indexed citations i.

Xiang Dai has authored 22 papers that have received a total of 354 indexed citations. This includes 9 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Gear and Bearing Dynamics Analysis (3 papers) and 3D IC and TSV technologies (3 papers). Xiang Dai is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Gear and Bearing Dynamics Analysis (3 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in China, United States and Hong Kong. Xiang Dai's co-authors include Paul S. Ho, Jiaqiang Zheng, Robert G. Parker, M. Brillhart and Christopher G. Cooley and has published in prestigious journals such as Journal of Cleaner Production, Journal of the Science of Food and Agriculture and Powder Technology