Xin Fu Tan
About
Xin Fu Tan has authored 50 papers that have received a total of 497 indexed citations.
This includes 34 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 13 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (11 papers). Xin Fu Tan is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (11 papers) and collaborates with scholars based in Australia, Japan and China. Xin Fu Tan's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Qinfen Gu, Syo Matsumura and Wenhui Yang and has published in prestigious journals such as Journal of Power Sources, Acta Materialia and Electrochimica Acta
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by José Lopes are published in Top authors papers by N. Booth are co-authored with Top countries impacted by papers by Lanshu Zhou Top authors papers by Martin Baunacke are co-authored with Top journals papers by G. Lopez‐Reyes are published in Top countries impacted by papers by Verónica López Top journals papers by Zuoming Zhang are published in Top countries impacted by papers by Merendino Ka