Xin Fu Tan

50 papers and 497 indexed citations i.

Xin Fu Tan has authored 50 papers that have received a total of 497 indexed citations. This includes 34 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 13 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (11 papers). Xin Fu Tan is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (11 papers) and collaborates with scholars based in Australia, Japan and China. Xin Fu Tan's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Qinfen Gu, Syo Matsumura and Wenhui Yang and has published in prestigious journals such as Journal of Power Sources, Acta Materialia and Electrochimica Acta