Xiuqin Wei
About
Xiuqin Wei has authored 37 papers that have received a total of 357 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 18 papers in Materials Chemistry and 10 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Silicon Nanostructures and Photoluminescence (7 papers) and Aluminum Alloy Microstructure Properties (6 papers). Xiuqin Wei is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Silicon Nanostructures and Photoluminescence (7 papers) and Aluminum Alloy Microstructure Properties (6 papers) and collaborates with scholars based in China, United Kingdom and United States. Xiuqin Wei's co-authors include Lang Zhou, Huizhen Huang, Zhihao Yue, Naigen Zhou and Zhigang Xiao and has published in prestigious journals such as Journal of Materials Science, Applied Surface Science and Solid State Ionics
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