Xu Shi

56 papers and 1.2k indexed citations i.

Xu Shi has authored 56 papers that have received a total of 1.2k indexed citations. This includes 29 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (11 papers) and Mechanical Behavior of Composites (6 papers). Xu Shi is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (11 papers) and Mechanical Behavior of Composites (6 papers) and collaborates with scholars based in Singapore, China and Hong Kong. Xu Shi's co-authors include J.H.L. Pang, Wei Zhou, Beng Kang Tay and Z. P. Wang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Hazardous Materials