Xuemei Li
About
Xuemei Li has authored 37 papers that have received a total of 315 indexed citations.
This includes 16 papers in Mechanical Engineering, 15 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Semiconductor Quantum Structures and Devices (5 papers). Xuemei Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Semiconductor Quantum Structures and Devices (5 papers) and collaborates with scholars based in China and United States. Xuemei Li's co-authors include Fenglian Sun and Xiaobei Hu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Medicinal Chemistry
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