Xuemin Pan

18 papers and 333 indexed citations i.

Xuemin Pan has authored 18 papers that have received a total of 333 indexed citations. This includes 10 papers in Mechanical Engineering, 6 papers in Electrical and Electronic Engineering and 5 papers in Civil and Structural Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Additive Manufacturing Materials and Processes (4 papers). Xuemin Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Additive Manufacturing Materials and Processes (4 papers) and collaborates with scholars based in China, United States and Singapore. Xuemin Pan's co-authors include Ning Zhao, Zhenkun Lei, S.M. Gaytan, Ryan B. Wicker and L.E. Murr and has published in prestigious journals such as Acta Materialia, Journal of Materials Science and Sustainability