Y. C. Chan

53 papers and 959 indexed citations i.

Y. C. Chan has authored 53 papers that have received a total of 959 indexed citations. This includes 48 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 9 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (23 papers) and Intermetallics and Advanced Alloy Properties (13 papers). Y. C. Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (23 papers) and Intermetallics and Advanced Alloy Properties (13 papers) and collaborates with scholars based in Hong Kong, United Kingdom and United States. Y. C. Chan's co-authors include J.K.L. Lai, Chen‐Yi Lee, Ahmed Sharif, Xin Gu and D.P. Webb and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and Journal of Applied Physics