Y. Le Tiec
About
Y. Le Tiec has authored 16 papers that have received a total of 364 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 2 papers in Materials Chemistry and 2 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (5 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Y. Le Tiec is often cited by papers focused on 3D IC and TSV technologies (5 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in France, The Netherlands and Ukraine. Y. Le Tiec's co-authors include L. Di Cioccio, H. Moriceau, P. Besson, F. Letertre and M. Bruel and has published in prestigious journals such as Applied Physics Letters, IEEE Electron Device Letters and Electronics Letters
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