Y. S. Lai

19 papers and 282 indexed citations i.

Y. S. Lai has authored 19 papers that have received a total of 282 indexed citations. This includes 12 papers in Electrical and Electronic Engineering, 5 papers in Nuclear and High Energy Physics and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (6 papers) and Particle physics theoretical and experimental studies (5 papers). Y. S. Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (6 papers) and Particle physics theoretical and experimental studies (5 papers) and collaborates with scholars based in Taiwan, United States and Singapore. Y. S. Lai's co-authors include W.D. van Driel, C. R. Kao, S.K.W. Seah, J.F.J.M. Caers and E.H. Wong and has published in prestigious journals such as Journal of Applied Physics, Physics Letters B and Journal of High Energy Physics