Yan‐Cheong Chan

14 papers and 296 indexed citations i.

Yan‐Cheong Chan has authored 14 papers that have received a total of 296 indexed citations. This includes 11 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Copper Interconnects and Reliability (5 papers). Yan‐Cheong Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Hong Kong, China and Singapore. Yan‐Cheong Chan's co-authors include Ze Zhu, Fengshun Wu, Leena Ukkonen, Lauri Sydänheimo and Johanna Virkki and has published in prestigious journals such as Materials Science and Engineering A, Japanese Journal of Applied Physics and IEEE Antennas and Wireless Propagation Letters