Yann Civale
About
Yann Civale has authored 21 papers that have received a total of 239 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (6 papers). Yann Civale is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in Belgium, The Netherlands and Japan. Yann Civale's co-authors include Eric Beyne, Lis K. Nanver, Harold Philipsen, Kristof Croes and A. Redolfi and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and IEEE Electron Device Letters
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