Yaocheng Zhang
About
Yaocheng Zhang has authored 61 papers that have received a total of 958 indexed citations.
This includes 53 papers in Mechanical Engineering, 28 papers in Electrical and Electronic Engineering and 16 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloys Composites Properties (26 papers) and 3D IC and TSV technologies (15 papers). Yaocheng Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloys Composites Properties (26 papers) and 3D IC and TSV technologies (15 papers) and collaborates with scholars based in China, Australia and United Kingdom. Yaocheng Zhang's co-authors include Jun Dai, Jinguo Ge, Feng Xu and Song Pang and has published in prestigious journals such as ACS Applied Materials & Interfaces, Journal of Membrane Science and Materials Science and Engineering A.
In The Last Decade
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