Y.C. Chan

93 papers and 2.0k indexed citations i.

Y.C. Chan has authored 93 papers that have received a total of 2.0k indexed citations. This includes 80 papers in Electrical and Electronic Engineering, 40 papers in Mechanical Engineering and 17 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (43 papers) and Advanced Welding Techniques Analysis (12 papers). Y.C. Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (43 papers) and Advanced Welding Techniques Analysis (12 papers) and collaborates with scholars based in Hong Kong, China and United Kingdom. Y.C. Chan's co-authors include M.O. Alam, K.C. Hung, J.K.L. Lai, C. Bailey and Hua Lu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials