Y.C. Chan
About
Y.C. Chan has authored 145 papers that have received a total of 3.8k indexed citations.
This includes 135 papers in Electrical and Electronic Engineering, 83 papers in Mechanical Engineering and 18 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (121 papers), 3D IC and TSV technologies (80 papers) and Advanced Welding Techniques Analysis (32 papers). Y.C. Chan is often cited by papers focused on Electronic Packaging and Soldering Technologies (121 papers), 3D IC and TSV technologies (80 papers) and Advanced Welding Techniques Analysis (32 papers) and collaborates with scholars based in Hong Kong, China and United Kingdom. Y.C. Chan's co-authors include Ahmed Sharif, M.O. Alam, Bin Wu, Fengshun Wu and K.C. Yung and has published in prestigious journals such as Journal of Applied Physics, Chemistry of Materials and Journal of Hazardous Materials
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