Yeong K. Kim
About
Yeong K. Kim has authored 14 papers that have received a total of 527 indexed citations.
This includes 12 papers in Mechanics of Materials, 6 papers in Mechanical Engineering and 5 papers in Electrical and Electronic Engineering. The topics of these papers are Mechanical Behavior of Composites (8 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (5 papers). Yeong K. Kim is often cited by papers focused on Mechanical Behavior of Composites (8 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (5 papers) and collaborates with scholars based in South Korea and United States. Yeong K. Kim's co-authors include Scott R. White, Jae-Seong Kim, Boyoung Lee, Sang-Yul Lee and Insu Park and has published in prestigious journals such as Polymer Engineering and Science, Microelectronics Reliability and Journal of Reinforced Plastics and Composites.
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by George Stonehouse are about Top countries impacted by papers by Roger Ying Top authors papers by J. Jing are co-authored with Top journals papers by Julia Bykova are published in Top authors papers by Ahmet Sağlamer are co-authored with Top journals papers by M. Moher are published in Top journals papers by Jari Mikkola are published in Top fields papers by Luqian Zhao are about