Yeong K. Kim
About
Yeong K. Kim has authored 14 papers that have received a total of 522 indexed citations.
This includes 12 papers in Mechanics of Materials, 6 papers in Mechanical Engineering and 5 papers in Electrical and Electronic Engineering. The topics of these papers are Mechanical Behavior of Composites (8 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (5 papers). Yeong K. Kim is often cited by papers focused on Mechanical Behavior of Composites (8 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (5 papers) and collaborates with scholars based in South Korea and United States. Yeong K. Kim's co-authors include Scott R. White, Jae-Seong Kim, Boyoung Lee, Sang-Yul Lee and Insu Park and has published in prestigious journals such as Polymer Engineering and Science, Microelectronics Reliability and Journal of Reinforced Plastics and Composites
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