Yi Zhong
About
Yi Zhong has authored 89 papers that have received a total of 754 indexed citations.
This includes 45 papers in Electrical and Electronic Engineering, 31 papers in Mechanical Engineering and 15 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (9 papers). Yi Zhong is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (9 papers) and collaborates with scholars based in China, United Kingdom and United States. Yi Zhong's co-authors include Ning Zhao, Mingliang Huang, Wei Dong, Haitao Ma and Haoran Ma and has published in prestigious journals such as Applied Physics Letters, Advanced Functional Materials and Advanced Energy Materials
In The Last Decade
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