Yingtao Ding
About
Yingtao Ding has authored 65 papers that have received a total of 671 indexed citations.
This includes 47 papers in Electrical and Electronic Engineering, 19 papers in Biomedical Engineering and 10 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (10 papers). Yingtao Ding is often cited by papers focused on 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (10 papers) and collaborates with scholars based in China, United States and Denmark. Yingtao Ding's co-authors include Zhiming Chen, Huikai Xie, Yangyang Yan, Yilin Sun and Shiwei Wang and has published in prestigious journals such as Advanced Functional Materials, Optics Letters and Optics Express
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