Yingxia Liu
About
Yingxia Liu has authored 68 papers that have received a total of 1.1k indexed citations.
This includes 38 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 15 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (21 papers) and Copper Interconnects and Reliability (7 papers). Yingxia Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (21 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in China, Hong Kong and United States. Yingxia Liu's co-authors include Xiuchen Zhao, K. N. Tu, Chengwen Tan, K. N. Tu and Dongwook Kim and has published in prestigious journals such as Advanced Materials, The Journal of Chemical Physics and Applied Physics Letters
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