Yi-Shao Lai
About
Yi-Shao Lai has authored 35 papers that have received a total of 619 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 13 papers in Mechanics of Materials and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (13 papers) and Metal and Thin Film Mechanics (9 papers). Yi-Shao Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (13 papers) and Metal and Thin Film Mechanics (9 papers) and collaborates with scholars based in Taiwan, United States and Italy. Yi-Shao Lai's co-authors include Sheng‐Rui Jian, K. N. Tu, Jenh‐Yih Juang, Hua‐Chiang Wen and K. N. Tu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Ingrid Ljuslinder are published in Top fields papers by Won Yu Kang are about Top countries impacted by papers by Chee Fui Chong Top countries impacted by papers by G.S. Kanner Top journals papers by Stefano Ferrari are published in Top authors papers by Richard Peach are co-authored with Top authors papers by Xianjin Chen are co-authored with Top authors papers by Yu Meng are co-authored with